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1. (WO2017180858) MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE

Pub. No.:    WO/2017/180858    International Application No.:    PCT/US2017/027397
Publication Date: Fri Oct 20 01:59:59 CEST 2017 International Filing Date: Fri Apr 14 01:59:59 CEST 2017
IPC: H04R 19/04
B81B 7/00
H04R 19/00
H04R 1/06
Applicants: ROBERT BOSCH GMBH
SAXENA, Kuldeep
AKUSTICA, INC.
Inventors: SAXENA, Kuldeep
Title: MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE
Abstract:
A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.