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1. (WO2017180482) NEURAL-INTERFACE PROBE AND METHODS OF PACKAGING THE SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/180482 International Application No.: PCT/US2017/026707
Publication Date: 19.10.2017 International Filing Date: 07.04.2017
IPC:
A61N 1/05 (2006.01) ,A61B 5/04 (2006.01) ,A61B 5/0478 (2006.01) ,B29C 45/14 (2006.01) ,G03F 7/20 (2006.01)
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
N
ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1
Electrotherapy; Circuits therefor
02
Details
04
Electrodes
05
for implantation or insertion into the body, e.g. heart electrode
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
5
Measuring for diagnostic purposes; Identification of persons
04
Measuring bioelectric signals of the body or parts thereof
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
5
Measuring for diagnostic purposes; Identification of persons
04
Measuring bioelectric signals of the body or parts thereof
0476
Electroencephalography
0478
Electrodes specially adapted therefor
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14
incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants: PARADROMICS, INC.[US/US]; 519 Parrott Street San Jose, CA 95112, US
Inventors: ANGLE, Matthew, R.; US
KONG, Yifan; US
Agent: AU, Hin, Meng; US
AGRAWAL, Trisha; US
ADVANI, Raj; US
AMODEO, Gabriele; US
ALEMOZAFAR, Ali; US
Priority Data:
62/321,12611.04.2016US
Title (EN) NEURAL-INTERFACE PROBE AND METHODS OF PACKAGING THE SAME
(FR) SONDE D'INTERFACE NEURONALE ET SES PROCÉDÉS D'ENCAPSULATION
Abstract:
(EN) A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.
(FR) La présente invention concerne une sonde d’interface neuronale. La sonde peut comprendre une puce, un substrat de faisceau de fils et un matériau d'encapsulation. La puce peut comprendre une pluralité de plots de connexion. Le substrat de faisceau de fils peut comprendre une pluralité de fils s'étendant à travers le substrat. La pluralité de fils peut comprendre : (1) une partie proximale connectée à la pluralité de plots de connexion de façon à coupler la puce au substrat, et (2) une partie distale flexible configurée pour être interfacée avec la matière neuronale. Le matériau d'encapsulation peut être disposé au moins entre la puce et le substrat de faisceau de fils.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)