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1. (WO2017180390) COMMUNICATION JACK HAVING A DIELECTRIC FILM BETWEEN PLUG INTERFACE CONTACTS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/180390 International Application No.: PCT/US2017/026140
Publication Date: 19.10.2017 International Filing Date: 05.04.2017
IPC:
H01R 13/6461 (2011.01) ,H01R 13/6464 (2011.01) ,H01R 24/64 (2011.01) ,H01R 13/6466 (2011.01) ,H01R 13/6469 (2011.01) ,H01R 12/71 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
646
specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
6461
Means for preventing cross-talk
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
646
specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
6461
Means for preventing cross-talk
6464
by adding capacitive elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
24
Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
60
Contacts spaced along planar side wall transverse to longitudinal axis of engagement
62
Sliding engagements with one side only, e.g. modular jack coupling devices
64
for high frequency, e.g. RJ 45
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
646
specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
6461
Means for preventing cross-talk
6464
by adding capacitive elements
6466
on substrates, e.g. PCBs [Printed Circuit Boards]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
646
specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
6461
Means for preventing cross-talk
6467
by cross-over of signal conductors
6469
on substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70
Coupling devices
71
for rigid printing circuits or like structures
Applicants: PANDUIT CORP.[US/US]; Legal Department 18900 Panduit Drive Tinley Park, Illinois 60487, US
Inventors: PATEL, Satish I.; US
CHURNOVIC, Roman J.; US
MUTANGANA, Jean de Dieu; US
Agent: WILLIAMS, James H.; US
MARLOW, Christopher S.; US
MCVADY, Aimee E.; US
Priority Data:
15/097,55313.04.2016US
Title (EN) COMMUNICATION JACK HAVING A DIELECTRIC FILM BETWEEN PLUG INTERFACE CONTACTS
(FR) PRISE DE COMMUNICATION POURVU D'UN FILM DIÉLECTRIQUE ENTRE DES CONTACTS D'INTERFACE DE FICHE
Abstract:
(EN) Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
(FR) Selon des modes de réalisation, la présente invention concerne des conceptions de prises de réseau qui peuvent servir à une connectivité de câble. Dans un mode de réalisation, la présente invention est une prise téléphonique RJ45 qui utilise un film diélectrique mince entre deux couches de PIC qui fournissent une compensation de diaphonie au moyen de leur géométrie. La compensation est obtenue au moyen de plaques de condensateur qui prennent en sandwich un film diélectrique mince. Ceci permet aux couches de PIC d'être à proximité étroite et d'obtenir un couplage plus élevé, à l'endroit voulu, permettant qu'une plus grande amplitude de compensation se produise à proximité du point de contact de fiche/prise. Ceci peut produire l'effet d'une compensation de déplacement plus proche du point de contact de fiche/prise, qui, à son tour, peut réduire l'amplitude de compensation nécessaire plus loin le long du trajet de données.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)