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1. (WO2017179907) ENCAPSULATION FILM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/179907    International Application No.:    PCT/KR2017/003964
Publication Date: 19.10.2017 International Filing Date: 12.04.2017
IPC:
B32B 3/02 (2006.01), B32B 3/26 (2006.01), B32B 7/12 (2006.01), B32B 38/00 (2006.01), H01L 51/52 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: YOO, Hyun Jee; (KR).
KIM, Hyun Suk; (KR).
MOON, Jung Ok; (KR).
YANG, Se Woo; (KR).
KIM, Jae Jin; (KR).
SEO, Dae Han; (KR).
SONG, Min Soo; (KR).
LEE, Jung Woo; (KR)
Agent: DANA PATENT LAW FIRM; 5th Floor, New Wing, Gwangsung Bldg., 11, Yeoksam-ro 3-gil, Gangnam-gu, Seoul 06242 (KR)
Priority Data:
10-2016-0044520 12.04.2016 KR
10-2016-0044519 12.04.2016 KR
Title (EN) ENCAPSULATION FILM
(FR) FILM D'ENCAPSULATION
(KO) 봉지 필름
Abstract: front page image
(EN)The present invention relates to an encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same. The present invention provides an encapsulation film which can form a structure capable of effectively blocking moisture or oxygen which is introduced into an organic electronic device from the outside, and has excellent handling and processability as well as excellent durability and bonding properties between the encapsulation film and organic electronic element.
(FR)La présente invention porte sur un film d'encapsulation, sur un procédé de fabrication de celui-ci, sur un dispositif électronique organique le comprenant, et sur un procédé de fabrication d'un dispositif électronique organique. La présente invention concerne un film d'encapsulation qui peut former une structure pouvant bloquer efficacement l'humidité ou l'oxygène qui est introduit dans un dispositif électronique organique depuis l'extérieur, et présente une excellente aptitude à la manipulation et au traitement ainsi qu'une excellente durabilité et d'excellentes propriétés de liaison entre le film d'encapsulation et l'élément électronique organique.
(KO)본 출원은 봉지 필름, 이의 제조 방법, 이를 포함하는 유기전자장치 및 이를 이용한 유기전자장치의 제조 방법에 관한 것으로서, 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 효과적으로 차단할 수 있는 구조의 형성이 가능하고, 취급성 및 가공성이 우수하며, 봉지 필름과 유기전자소자 간의 합착 특성 및 내구 신뢰성이 우수한 봉지 필름을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)