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1. (WO2017179643) LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
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Pub. No.: WO/2017/179643 International Application No.: PCT/JP2017/015075
Publication Date: 19.10.2017 International Filing Date: 13.04.2017
IPC:
B23K 26/38 (2014.01) ,B23K 26/00 (2014.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
Applicants: AMADA HOLDINGS CO.,LTD.[JP/JP]; 200, Ishida, Isehara-shi, Kanagawa 2591196, JP
Inventors: IMAI Norio; JP
TAKANO Hiroshi; JP
SHIBATA Takahiro; JP
NAKAMURA Ko; JP
Agent: MIYOSHI Hidekazu; JP
TAKAHASHI Shunichi; JP
ITO Masakazu; JP
TAKAMATSU Toshio; JP
Priority Data:
2016-08205015.04.2016JP
2017-07686607.04.2017JP
Title (EN) LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT LASER ET PROCÉDÉ DE TRAITEMENT LASER
(JA) レーザ加工装置およびレーザ加工方法
Abstract:
(EN) Provided is a laser processing device that performs laser processing on a workpiece to which a protective film has been attached, wherein a determination is made as to whether or not a common part for which laser marking processing is necessary for cutting the protective film is present on the basis of processing information including a processing program, and when a common part for which laser marking processing is necessary for cutting the protective film is present, the laser marking processing process for that common part is added to the processing program.
(FR) La présente invention concerne un dispositif de traitement laser qui effectue un traitement laser sur une pièce de fabrication sur laquelle un film protecteur a été fixé, une détermination étant effectuée pour déterminer si une partie commune pour laquelle un traitement de marquage laser est ou non nécessaire pour découper le film protecteur est présente sur la base d'informations de traitement comprenant un programme de traitement, et lorsqu'une partie commune pour laquelle un traitement de marquage au laser est nécessaire pour découper le film protecteur est présente, le processus de traitement de marquage au laser pour cette partie commune est ajouté au programme de traitement.
(JA) 保護フィルムが貼られたワークに対してレーザ加工を行うレーザ加工装置であって、加工プログラムを含む加工情報に基づいて、保護フィルムをカットするためのレーザマーキング加工が必要な共有部分が有るか否かを判別し、保護フィルムをカットするレーザマーキング加工が必要な共有部分が有る場合、その共有部分のレーザマーキング加工処理を前記加工プログラムに追加する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)