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1. (WO2017179562) RFID TAG AND RFID SYSTEM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/179562    International Application No.:    PCT/JP2017/014772
Publication Date: 19.10.2017 International Filing Date: 11.04.2017
IPC:
G06K 19/077 (2006.01), G06K 19/02 (2006.01), H01F 38/14 (2006.01), H01Q 1/40 (2006.01), H01Q 7/06 (2006.01)
Applicants: KYOCERA CORPORATION [JP/JP]; 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501 (JP)
Inventors: YAMAMOTO,Shuuichi; (JP).
OCHIAI,Kensou; (JP)
Priority Data:
2016-080388 13.04.2016 JP
Title (EN) RFID TAG AND RFID SYSTEM
(FR) ÉTIQUETTE RFID ET SYSTÈME RFID
(JA) RFIDタグおよびRFIDシステム
Abstract: front page image
(EN)An RFID tag 10 according to the present disclosure is provided with: an insulating substrate 1 that has an upper surface 1a; a coil conductor 2 that is arranged within the insulating substrate 1; a semiconductor element 3 that is mounted on the upper surface 1a of the insulating substrate 1; and a mold resin 4 that covers the upper surface 1a of the insulating substrate 1 and the semiconductor element 3. The mold resin 4 contains a plurality of magnetic particles 5 which have diameters different from each other.
(FR)Selon la présente invention, une étiquette RFID (10) comporte : un substrat isolant (1) qui présente une surface supérieure (1a) ; un conducteur de bobine (2) qui est agencé à l'intérieur du substrat isolant (1) ; un élément semi-conducteur (3) qui est monté sur la surface supérieure (1a) du substrat isolant (1) ; et une résine de moulage (4) qui recouvre la surface supérieure (1a) du substrat isolant (1) et l'élément semi-conducteur (3). La résine de moulage (4) comporte une pluralité de particules magnétiques qui présentent des diamètres différents.
(JA)本開示のRFIDタグ10は、上面1aを有する絶縁基板1と、該絶縁基板1の内部に配置されたコイル導体2と、前記絶縁基板1の前記上面1aに搭載された半導体素子3と、前記絶縁基板1の前記上面1aおよび前記半導体素子3を被覆しているモールド樹脂4とを備えており、該モールド樹脂4が、互いに粒径の異なる複数の磁性体粒子5を含有している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)