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1. (WO2017179532) CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/179532 International Application No.: PCT/JP2017/014656
Publication Date: 19.10.2017 International Filing Date: 10.04.2017
IPC:
H01B 1/22 (2006.01) ,H01B 1/00 (2006.01) ,H01L 21/60 (2006.01) ,H05K 1/14 (2006.01) ,H05K 3/32 (2006.01) ,B23K 35/26 (2006.01) ,B23K 35/363 (2006.01) ,C22C 13/00 (2006.01)
Applicants: SEKISUI CHEMICAL CO., LTD.[JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors: KUBOTA, Takashi; JP
NISHIOKA, Keizo; JP
Agent: MIYAZAKI & METSUGI; Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2016-07979012.04.2016JP
Title (EN) CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
(FR) MATÉRIAU CONDUCTEUR ET STRUCTURE CONNECTÉE
(JA) 導電材料及び接続構造体
Abstract: front page image
(EN) Provided is a conductive material which is capable of efficiently arranging a solder between electrodes to be connected, thereby being capable of enhancing the conduction reliability and insulation reliability. A conductive material according to the present invention comprises: a plurality of first conductive particles, each of which contains a solder in an outer surface portion of a conductive part; second conductive particles, each of which contains silver, ruthenium, iridium, gold, palladium or platinum in an outer surface portion of a conductive part; a thermosetting compound; and a thermal curing agent.
(FR) L'invention concerne un matériau conducteur qui est capable d'arranger efficacement une brasure entre des électrodes à connecter, ce qui lui permet d'améliorer la fiabilité de conduction et la fiabilité d'isolation. Un matériau conducteur selon la présente invention comprend : une pluralité de premières particules conductrices, dont chacune contient une brasure dans une portion de surface extérieure d'une partie conductrice ; des deuxièmes particules conductrices, dont chacune contient de l'argent, du ruthénium, de l'iridium, de l'or, du palladium ou du platine dans une portion de surface extérieure d'une partie conductrice ; un composé thermodurcissable ; et un agent de durcissement thermique.
(JA) 接続されるべき電極間に、はんだを効率的に配置することができ、導通信頼性及び絶縁信頼性を高めることができる導電材料を提供する。 本発明に係る導電材料は、導電部の外表面部分に、はんだを有する複数の第1の導電性粒子と、導電部の外表面部分に、銀、ルテニウム、イリジウム、金、パラジウム又は白金を有する第2の導電性粒子と、熱硬化性化合物と、熱硬化剤とを含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)