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|1. (WO2017179104) SEMICONDUCTOR ELEMENT BONDING STRUCTURE, IMAGE PICKUP MODULE, AND ENDOSCOPE DEVICE|
|Title:||SEMICONDUCTOR ELEMENT BONDING STRUCTURE, IMAGE PICKUP MODULE, AND ENDOSCOPE DEVICE|
A semiconductor element bonding structure 30 is provided with: a first silicon wafer 31, on which an electrode 34 is formed around a through hole 33; and a second silicon wafer 41, on which the first silicon wafer 31 is laminated, and a metal column section 45 inserted and fitted in the through hole 33 is formed. The metal column section 41 is provided with: a pedestal metal 43 that is provided on the second silicon wafer 41; and a low-melting-point metal 44, which is configured such that the low-melting-point metal melts and is electrically connected to the electrode 34 of the first silicon wafer 31 by being laminated on the pedestal metal 43, said low-melting-point metal having a melting point temperature that is lower than that of the pedestal metal 43.