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1. (WO2017176641) AN APPARATUS AND METHOD TO CONTROL ETCH RATE THROUGH ADAPTIVE SPIKING OF CHEMISTRY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/176641    International Application No.:    PCT/US2017/025768
Publication Date: 12.10.2017 International Filing Date: 03.04.2017
IPC:
C03C 25/68 (2006.01), C23F 1/00 (2006.01)
Applicants: VEECO PRECISION SURFACE PROCESSING LLC [US/US]; 185 Gibraltar Road Horsham, PA 19044 (US)
Inventors: MAUER, Laura; (US).
TADDEI, John; (US).
SWALLOW, James; (US).
GOLBERG, David; (US).
ZWIRNMANN, Eric, Kurt; (US)
Agent: ELLIS, Edward, J.; (US).
LEASON, David; (US)
Priority Data:
62/318,574 05.04.2016 US
Title (EN) AN APPARATUS AND METHOD TO CONTROL ETCH RATE THROUGH ADAPTIVE SPIKING OF CHEMISTRY
(FR) APPAREIL ET PROCÉDÉ POUR CONTRÔLER LE TAUX DE GRAVURE PAR DOPAGE CHIMIQUE ADAPTATIF
Abstract: front page image
(EN)An apparatus and method are provided to: determine a unique profile to etch each wafer, execute that etch, and determine and deliver the proper chemical addition in order to maintain etch rate within tight tolerances.
(FR)L'invention concerne un appareil et un procédé pour : déterminer un profil unique pour graver chaque tranche de silicium, exécuter ladite gravure, et déterminer et procéder à l'apport chimique approprié pour maintenir le taux de gravure dans des tolérances serrées.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)