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1. (WO2017176314) PROCESS COMPATIBILITY IMPROVEMENT BY FILL FACTOR MODULATION

Pub. No.:    WO/2017/176314    International Application No.:    PCT/US2016/060626
Publication Date: Fri Oct 13 01:59:59 CEST 2017 International Filing Date: Sat Nov 05 00:59:59 CET 2016
IPC: G03F 7/20
G03F 7/00
H01L 21/027
H01L 21/66
Applicants: KLA-TENCOR CORPORATION
Inventors: LEVINSKI, Vladimir
HAJAJ, Eitan
ITZKOVICH, Tal
AHARON, Sharon
ADEL, Michael E.
PASKOVER, Yuri
NEGRI, Daria
LUBASHEVSKY, Yuval
MANASSEN, Amnon
LEE, Myungjun
SMITH, Mark D
Title: PROCESS COMPATIBILITY IMPROVEMENT BY FILL FACTOR MODULATION
Abstract:
Metrology targets and target design methods are provided, in which target elements are defined by replacing elements from a periodic pattern having a pitch p, by assist elements having at least one geometric difference from the replaced elements, to form a composite periodic structure that maintains the pitch p as a single pitch. Constructing targets within the bounds of compatibility with advanced multiple patterning techniques improves the fidelity of the targets and fill factor modulation enables adjustment of the targets to produce sufficient metrology sensitivity for extracting the overlay while achieving process compatibility of the targets.