WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2017176008) FINGERPRINT RECOGNITION MODULE, ELECTRONIC DEVICE EMPLOYING SAME, AND METHOD FOR MANUFACTURING SOUND WAVE CONTROL MEMBER THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/176008    International Application No.:    PCT/KR2017/003535
Publication Date: 12.10.2017 International Filing Date: 31.03.2017
IPC:
G06K 9/00 (2006.01), A61B 5/1172 (2016.01), H03H 7/38 (2006.01)
Applicants: KOREA INSTITUTE OF MACHINERY & MATERIALS [KR/KR]; 156, Gajeongbuk-ro Yuseong-gu Daejeon 34103 (KR)
Inventors: HUR, Shin; (KR).
SONG, Kyung-jun; (KR).
KWAK, Jun-hyuk; (KR)
Agent: KIM, Min-tae; (KR)
Priority Data:
10-2016-0042493 06.04.2016 KR
Title (EN) FINGERPRINT RECOGNITION MODULE, ELECTRONIC DEVICE EMPLOYING SAME, AND METHOD FOR MANUFACTURING SOUND WAVE CONTROL MEMBER THEREFOR
(FR) MODULE DE RECONNAISSANCE D'EMPREINTES DIGITALES, DISPOSITIF ÉLECTRONIQUE UTILISANT LEDIT MODULE, ET PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE COMMANDE D'ONDES SONORES S'Y RAPPORTANT
(KO) 지문인식모듈과, 이것이 적용된 전자기기, 그리고 이를 위한 음파제어부재의 제조방법
Abstract: front page image
(EN)The present invention relates to a fingerprint recognition module capable of enhancing the recognition rate of ultrasonic waves and improving the accuracy of fingerprint recognition, an electronic device employing the same, and a method for manufacturing a sound wave control member therefor. To this end, the fingerprint recognition module comprises: a contact member with which a fingerprint comes into contact; a transducer for outputting an ultrasonic signal to the contact member and receiving a ultrasonic signal reflected from the contact member; an impedance matching member filled between the contact member and the transducer so as to transmit an ultrasonic signal between the contact member and the transducer; a sound wave control member inserted between the contact member and the transducer and having the impedance matching member filled therein; and a signal processing unit electrically connected to the transducer so as to sense a fingerprint according to a received ultrasonic signal.
(FR)La présente invention concerne un module de reconnaissance d'empreintes digitales apte à améliorer le taux de reconnaissance d'ondes ultrasonores et à améliorer la précision de reconnaissance d'empreintes digitales, un dispositif électronique utilisant ledit module, et un procédé de fabrication d'un élément de commande d'ondes sonores s'y rapportant. À cette fin, le module de reconnaissance d'empreintes digitales comprend : un élément de contact avec lequel une empreinte digitale vient en contact ; un transducteur destiné à émettre un signal ultrasonore vers l'élément de contact et à recevoir un signal ultrasonore réfléchi par l'élément de contact ; un élément d'adaptation d'impédance placé entre l'élément de contact et le transducteur de façon à émettre un signal ultrasonore entre l'élément de contact et le transducteur ; un élément de commande d'ondes sonores introduit entre l'élément de contact et le transducteur et pourvu de l'élément d'adaptation d'impédance placé en son sein ; et une unité de traitement de signal connectée électriquement au transducteur de façon à détecter une empreinte digitale selon un signal ultrasonore reçu.
(KO)초음파의 인식율을 높이고, 지문 인식에 대한 정밀도를 향상시킬 수 있는 지문인식모듈과, 이것이 적용된 전자기기, 그리고 이를 위한 음파제어부재의 제조방법에 관한 것이다. 이를 위해 지문인식모듈은 지문이 접촉되는 접촉부재와, 접촉부재로 초음파 신호를 출력하고 접촉부재에서 반사되는 초음파 신호를 수신하는 트랜스듀서와, 접촉부재와 트랜스듀서 사이에 충진되어 접촉부재와 트랜스듀서 사이에서 초음파 신호를 전달하는 임피던스매칭부재와, 접촉부재와 트랜스듀서 사이에 삽입되고 임피던스매칭부재가 내부에 충진되는 음파제어부재 및 트랜스듀서와 전기적으로 접속되어 수신되는 초음파 신호에 따라 지문을 감지하는 신호처리유닛을 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)