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1. (WO2017175759) RESIN MOLDED BODY
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Pub. No.: WO/2017/175759 International Application No.: PCT/JP2017/014076
Publication Date: 12.10.2017 International Filing Date: 04.04.2017
IPC:
C08J 5/00 (2006.01) ,C08J 5/18 (2006.01) ,C08K 7/00 (2006.01) ,H01L 23/373 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants: SEKISUI CHEMICAL CO., LTD.[JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
SEKISUI TECHNO MOLDING CO., LTD.[JP/JP]; 6-2, Nishi-Shinbashi 2cho-me, Minato-ku, Tokyo 1050003, JP
Inventors: NAKAMURA, Kouzou; JP
SAWA, Kazuhiro; JP
SUENAGA, Yuusuke; JP
MATSUMURA, Ryuuji; JP
Agent: MIYAZAKI & METSUGI; Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2016-07511404.04.2016JP
2016-23661406.12.2016JP
Title (EN) RESIN MOLDED BODY
(FR) CORPS MOULÉ EN RÉSINE
(JA) 樹脂成形体
Abstract:
(EN) Provided is a resin molded body having excellent heat dissipation as well as impact resistance. The resin molded body having thermal conductivity and having a main surface contains a thermoplastic resin and graphite particles, wherein the volume average particle diameter of the graphite particles is at least 0.1 µm and less than 40 µm, the content of the graphite particles is 10-200 parts by weight with respect to 100 parts by weight of the thermoplastic resin, and the thermal conductivity λx in the x-direction, the thermal conductivity λy in the y-direction, and the thermal conductivity λz in the z-direction satisfy min(λx, λy)/ λz≥3, where the x-direction is an arbitrary direction on the main surface, the y-direction is a direction which is on the main surface and perpendicular to the x-direction, and the z-direction is the thickness direction of the resin molded body.
(FR) La présente invention décrit un corps moulé en résine présentant une excellente dissipation de chaleur ainsi que résistance aux chocs. Le corps moulé en résine présentant une conductivité thermique et présentant une surface principale qui contient une résine thermoplastique et des particules de graphite, le diamètre de particule moyen en volume des particules de graphite est d’au moins 0,1 µm et inférieur à 40 µm, la teneur des particules de graphite est de 10 à 200 parties en poids par rapport à 100 parties en poids de la résine thermoplastique, et la conductivité thermique λx dans le sens x, la conductivité thermique λy dans le sens y, et la conductivité thermique λz dans le sens z satisfont min(λx, λy)/λz ≥ 3, où le sens x est un sens arbitraire sur la surface principale, le sens y est un sens qui se trouve sur la surface principale et perpendiculaire au sens x, et le sens z est le sens de l’épaisseur du corps moulé en résine.
(JA) 放熱性及び耐衝撃性の双方に優れる樹脂成形体を提供する。 熱伝導性を有し、かつ主面を有する樹脂成形体であって、熱可塑性樹脂と黒鉛粒子とを含み、前記黒鉛粒子の体積平均粒子径が、0.1μm以上、40μm未満であり、前記熱可塑性樹脂100重量部に対する前記黒鉛粒子の含有量が、10重量部以上、200重量部以下であり、前記主面において、任意の方向をx方向及び該x方向に直交する方向をy方向とし、前記樹脂成形体の厚み方向をz方向としたときに、前記x方向の熱伝導率λx、前記y方向の熱伝導率λy及び前記z方向の熱伝導率λzが、min(λx,λy)/λz≧3を満たしている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)