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Machine translation
1. (WO2017175742) MOUNTING FILM AND MOUNTING STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/175742    International Application No.:    PCT/JP2017/014020
Publication Date: 12.10.2017 International Filing Date: 04.04.2017
IPC:
H04M 1/11 (2006.01), C09J 7/02 (2006.01), H04M 1/02 (2006.01)
Applicants: SUNCREST CO., LTD. [JP/JP]; 12-42, Minamikamikosaka, Higashiosaka-shi, Osaka 5770814 (JP)
Inventors: UEDA, Minoru; (JP)
Agent: SAMEJIMA, Mutsumi; (JP).
OHATA, Yasushi; (JP).
IWAKI, Masanori; (JP)
Priority Data:
2016-078185 08.04.2016 JP
Title (EN) MOUNTING FILM AND MOUNTING STRUCTURE
(FR) FILM DE MONTAGE ET STRUCTURE DE MONTAGE
(JA) 取付フィルムおよび取付構造
Abstract: front page image
(EN)A mounting film (20) is mounted, via a first bonding layer, to the surface of a slidingly movable moving plate (32) on the inner surface of a base cover (1) of a protective cover (200) for protecting an electronic device (100) such that the electronic device is sandwiched between the base cover (1) and a lid cover. The mounting film has a two-layer structure comprising a base material layer to which the first bonding layer is joined, and a second boning layer which is joined to the back surface of the electronic device (100).
(FR)Selon la présente invention, un film de montage (20) est monté, par le biais d'une première couche de liaison, à la surface d'une plaque en mouvement se déplaçant de façon coulissante (32) sur la surface interne d'un couvercle de base (1) d'un couvercle protecteur (200) destiné à protéger un dispositif électronique (100) de telle sorte que le dispositif électronique est pris en sandwich entre le couvercle de base (1) et un couvercle de capot. Le film de montage possède une structure à double couche comprenant une couche de matériel de base à laquelle la première couche de liaison est jointe, et une seconde couche de liaison qui est jointe à la surface arrière du dispositif électronique (100).
(JA)基台カバー(1)と蓋カバーとによって電子機器(100)を挟むように保護する保護カバー(200)の、基台カバー(1)の内面のスライド移動可能な移動板(32)の表面に、第1接着層を介して、取り付けられる取付フィルム(20)であって、第1接着層が接合される基材層と、電子機器(100)の背面に接合する第2接着層と、からなる2層構造を有している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)