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1. (WO2017175645) DC/DC CONVERTER MODULE AND DC/DC CONVERTER CIRCUIT
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Pub. No.: WO/2017/175645 International Application No.: PCT/JP2017/013006
Publication Date: 12.10.2017 International Filing Date: 29.03.2017
IPC:
H02M 3/155 (2006.01)
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
3
Conversion of dc power input into dc power output
02
without intermediate conversion into ac
04
by static converters
10
using discharge tubes with control electrode or semiconductor devices with control electrode
145
using devices of a triode or transistor type requiring continuous application of a control signal
155
using semiconductor devices only
Applicants: MURATA MANUFACTURING CO., LTD.[JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors: YONEMORI, Keito; JP
YAZAKI, Hirokazu; JP
Agent: YOSHIKAWA, Shuichi; JP
SOBAJIMA, Masaaki; JP
Priority Data:
2016-07667006.04.2016JP
Title (EN) DC/DC CONVERTER MODULE AND DC/DC CONVERTER CIRCUIT
(FR) MODULE CONVERTISSEUR CONTINU-CONTINU ET CIRCUIT CONVERTISSEUR CONTINU-CONTINU
(JA) DCDCコンバータモジュールおよびDCDCコンバータ回路
Abstract:
(EN) This DC/DC converter module (1) is provided with: a multilayer substrate (10); a switching IC chip (32) that is mounted on the multilayer substrate (10); and a choke coil that is connected to the switching IC chip (32). The choke coil is configured of: a first coil (31) that is formed of a coil-like conductor pattern built in the multilayer substrate (10); and a chip-like second coil (34) that is connected in series to the first coil (31) and is mounted on the multilayer substrate (10).
(FR) L'invention concerne un module convertisseur continu-continu (1) qui est pourvu : d'un substrat multicouche (10) ; d'une puce de circuit intégré de commutation (32) qui est montée sur le substrat multicouche (10) ; d'une bobine d'arrêt qui est connectée à la puce de circuit intégré de commutation (32). La bobine d'arrêt est constituée : d'une première bobine (31) qui est formée d'un motif conducteur en forme de bobine incorporé dans le substrat multicouche (10) ; d'une seconde bobine du type puce (34) qui est connectée en série à la première bobine (31) et qui est montée sur le substrat multicouche (10).
(JA) DCDCコンバータモジュール(1)は、多層基板(10)と、多層基板(10)に実装されたスイッチングICチップ(32)と、スイッチングICチップ(32)に接続されたチョークコイルと、を備え、前記チョークコイルは、多層基板(10)に内蔵されたコイル状導体パターンによって形成された第1コイル(31)と、第1コイル(31)に直列接続され、多層基板(10)に実装されたチップ状の第2コイル(34)と、で構成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)