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1. (WO2017175397) MICA TAPE, CURED PRODUCT OF MICA TAPE, AND INSULATING MATERIAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/175397    International Application No.:    PCT/JP2016/061622
Publication Date: 12.10.2017 International Filing Date: 08.04.2016
IPC:
H01B 17/60 (2006.01), H01B 17/56 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: YAMAMOTO, Takaya; (JP).
MUROMACHI, Miyuki; (JP).
TAKITA, Takao; (JP).
FUKUSHIMA, Keiji; (JP).
TAKEZAWA, Yoshitaka; (JP)
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
Title (EN) MICA TAPE, CURED PRODUCT OF MICA TAPE, AND INSULATING MATERIAL
(FR) BANDE DE MICA, PRODUIT DURCI DE BANDE DE MICA ET MATÉRIAU ISOLANT
(JA) マイカテープ、マイカテープの硬化物及び絶縁物
Abstract: front page image
(EN)This mica tape is provided with a mica layer including mica, and a backing layer including a backing material. When mica pieces obtained from the mica layer which has been peeled from the backing layer are sieved using a JIS standard sieve, the proportion of mica pieces having a particle size of at least 2.8 mm is less than 45 mass% of all of the mica pieces.
(FR)La présente invention concerne une bande de mica qui comporte une couche de mica comprenant du mica, et une couche de renfort comprenant un matériau de renfort. Lorsque des morceaux de mica obtenus à partir de la couche de mica qui a été décollée à partir de la couche de renfort sont tamisés à l'aide d'un tamis standard JIS, la proportion de morceaux de mica ayant une taille de particule d'au moins 2,8 mm est inférieure à 45 % en masse de tous les morceaux de mica.
(JA) マイカを含むマイカ層と、裏打ち材を含む裏打ち層とを有し、前記裏打ち層から剥離した前記マイカ層から得られるマイカ片をJIS標準篩を用いて篩い分けしたときに、粒子径が2.8mm以上であるマイカ片の割合が、マイカ片全体の45質量%未満である、マイカテープ。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)