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1. (WO2017175263) SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/175263 International Application No.: PCT/JP2016/060990
Publication Date: 12.10.2017 International Filing Date: 04.04.2016
IPC:
H05K 1/11 (2006.01) ,H05K 1/02 (2006.01) ,H05K 3/40 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
Applicants:
株式会社メイコー MEIKO ELECTRONICS CO., LTD. [JP/JP]; 神奈川県綾瀬市大上5丁目14番15号 5-14-15, Ogami, Ayase-shi, Kanagawa 2521104, JP
Inventors:
関 保明 SEKI, Yasuaki; JP
高林 純平 TAKABAYASHI, Jumpei; JP
牧野 直之 MAKINO, Naoyuki; JP
志々目 和男 SHISHIME, Kazuo; JP
Agent:
荒井 滋人 ARAI, Shigeto; JP
Priority Data:
Title (EN) SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE
(FR) SUBSTRAT ET PROCÉDÉ DE FABRICATION DE SUBSTRAT
(JA) 基板及び基板の製造方法
Abstract:
(EN) A substrate (1) is provided with: a laminated wiring board (3) which has formed therein a plurality of conductive layers (2) composed of a conductive material; a through-hole (6) formed so as to penetrate the laminated wiring board (3); a metal piece (10) disposed inside the through-hole (6) so as to extend over the entire length of the through-hole (6); a bulging portion (8) that is formed so as to bulge outward from an outer edge of the through-hole (6) and is cut out along the entire length of the through-hole (6) in the longitudinal direction; a bulge hole (9) that is formed by being surrounded by the surfaces of the bulging portion (8) and the metal piece (10) that is exposed inside the bulging portion (8); and a plating film (13) that covers the inner wall of the bulge hole (9).
(FR) L'invention porte sur un substrat (1) qui est pourvu : d'une carte de câblage stratifiée (3) dans laquelle sont formées une pluralité de couches conductrices (2) composées d'un matériau conducteur; d'un trou traversant (6) formé de manière à pénétrer dans la carte de câblage stratifiée (3); d'une pièce métallique (10) disposée à l'intérieur du trou traversant (6) de façon à s'étendre sur toute la longueur du trou traversant (6); d'une partie à bombement (8) qui est formée de manière à bomber vers l'extérieur à partir d'un bord extérieur du trou traversant (6) et est découpée sur toute la longueur du trou traversant (6) dans la direction longitudinale; d'un trou de bombement (9) qui est formé en étant entouré par les surfaces de la partie à bombement (8) et de la pièce métallique (10) qui est apparente à l'intérieur de la partie à bombement (8); et d'un film de revêtement (13) qui recouvre la paroi intérieure du trou de bombement (9).
(JA) 基板(1)は、導電材料からなる導電層(2)が複数形成されている積層配線板(3)と、積層配線板(3)を貫通して形成されているスルーホール(6)と、スルーホール(6)全長に亘ってスルーホール(6)の内側に配されている金属片(10)と、スルーホール(6)の外縁から外方に膨らんでスルーホール(6)の長手方向全長に亘って切欠いて形成された膨出部(8)と、膨出部(8)及び膨出部(8)内に露出した金属片(10)の表面で囲まれて形成された膨出孔(9)と、膨出孔(9)の内壁を覆うめっき膜(13)とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)