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1. (WO2017174176) METHOD AND MOLDING TOOL FOR HOT-FORMING A FLAT THERMOPLASTIC LAMINATE

Pub. No.:    WO/2017/174176    International Application No.:    PCT/EP2017/000367
Publication Date: Fri Oct 13 01:59:59 CEST 2017 International Filing Date: Sat Mar 25 00:59:59 CET 2017
IPC: B29C 51/10
B29C 51/08
B29C 51/26
B29C 51/30
B29C 51/42
B29K 69/00
Applicants: NIEBLING GMBH
Inventors: DREXLER, Christian
NIEBLING, Curt
Title: METHOD AND MOLDING TOOL FOR HOT-FORMING A FLAT THERMOPLASTIC LAMINATE
Abstract:
A flat laminate piece (E) made of thermoplastic is hot-formed in a two-stage method. In a first stage, the flat laminate which consist of film(s) and/or panels(n) is placed on a flat frame-shaped pallet and is heated to a forming temperature in a heating zone between two flat heat screens in a contactless manner. The edge zone of the hot flat laminate piece (E) lies on the pallet such that the laminate piece cannot be clamped in a first laminate direction (R) but rather can be slid on the pallet in this direction (R). Two non-flat rigid contours which are identical or largely identical act on two opposing mutually spaced parallel laminate edge sections uniaxially and perpendicularly to the laminate plane and only in the first laminate direction (R), i.e. monodirectionally, and shape the entire heated laminate piece (E) into a monodirectionally molded preform (V). On a flat laminate piece (E) arranged on an XY plane, such a monodirectional forming process, which is carried out parallel to the X-axis for example, leaves the original straight lines (G1 to Gn) arranged parallel to the Y-axis unchanged and in their original length but changes the original straight lines (F1 to Fn) arranged parallel to the X-axis into curved lines (H1 to Hn). In a second stage, an isostatic high-pressure forming process is then carried out on the monodirectionally molded preform (V) under HPF conditions (high-pressure forming; cf. documents US 5 108 350 A, EP 0 371 425 B1, DE 38 40 542 C1) in order to produce a 3D molded part or in order to laminate a 3D carrier part with the laminate.