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1. (WO2017173350) MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF

Pub. No.:    WO/2017/173350    International Application No.:    PCT/US2017/025521
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Sat Apr 01 01:59:59 CEST 2017
IPC: H01B 3/12
H01B 3/40
H01L 23/66
H01Q 21/06
H05K 1/03
H05K 1/09
H05K 3/46
H01B 7/42
Applicants: SNAPTRACK, INC.
Inventors: KOBUKE, Hisashi
SOTOMA, Naoki
FUTAMATA, Yousuke
NINOMIYA, Emi
ISHIMOTO, Atsushi
Title: MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF
Abstract:
[Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate.