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1. (WO2017173152) STRETCHING RETENTION PLATE FOR ELECTRONIC ASSEMBLIES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/173152    International Application No.:    PCT/US2017/025157
Publication Date: 05.10.2017 International Filing Date: 30.03.2017
IPC:
H01L 23/538 (2006.01), H01L 23/498 (2006.01), H01L 23/00 (2006.01), H01L 23/40 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054 (US)
Inventors: CHAVEZ-CLEMENTE, Daniel; (US).
HEPPNER, Joshua D.; (US).
DURANOVIC, Naida; (US)
Agent: DYER, Richard A.; (US)
Priority Data:
15/089,480 02.04.2016 US
Title (EN) STRETCHING RETENTION PLATE FOR ELECTRONIC ASSEMBLIES
(FR) PLAQUE DE MAINTIEN D'ÉTIREMENT POUR ENSEMBLES ÉLECTRONIQUES
Abstract: front page image
(EN)A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.
(FR)L'invention concerne un système de plaque de maintien de substrat destiné à maintenir un substrat pour le traitement dans un processus de fabrication de dispositif électronique. Le système de plaque de maintien comprend une plaque supérieure et une plaque inférieure pour prendre en sandwich un substrat souple. De plus, la plaque supérieure comprend un certain nombre de cames pour étirer le substrat souple sur la plaque inférieure.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)