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Machine translation
1. (WO2017172203) FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/172203    International Application No.:    PCT/US2017/020147
Publication Date: 05.10.2017 International Filing Date: 01.03.2017
IPC:
H05K 9/00 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054 (US)
Inventors: YONG, Khang Choong; (MY).
HALL, Stephen H.; (US).
CHUAH, Tin Poay; (MY).
KOH, Boon Ping; (MY).
GOH, Eng Huat; (MY)
Agent: PERDOK, Monique M.; (US).
BLACK, David W., Reg. No. 42,331; (US).
BEEKMAN, Marvin L., Reg. No. 38,377; (US).
ARORA, Suneel, Reg. No. 42,267; (US).
BIANCHI, Timothy E., Reg. No. 39,610; (US).
WOO, Justin N., Reg. No. 62,686; (US).
MCCRACKIN, Ann M., Reg. No. 42,858; (US).
GOULD, James R., Reg. No. 72,086; (US).
SCHEER, Bradley W., Reg. No. 47,059; (US)
Priority Data:
15/089,303 01.04.2016 US
Title (EN) FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE
(FR) BOÎTIER EMI DE CIRCUIT IMPRIMÉ SOUPLE
Abstract: front page image
(EN)Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.
(FR)L'invention porte sur une conception architecturale de carte volumétrique tridimensionnelle (3D) qui offre des solutions techniques aux problèmes techniques relatifs à la miniaturisation des cartes de circuit imprimé. L'architecture volumétrique 3D comprend une plus grande utilisation du volume inutilisé dans la dimension verticale (par exemple, dimension Z) afin d'augmenter l'utilisation du volume total de la carte de circuit imprimé. L'architecture volumétrique 3D est réalisée par montage de composants sur une première PCB et sur une seconde PCB, et par inversion et suspension de la seconde PCB au-dessus de la première PCB. L'utilisation d'une conception architecturale de carte volumétrique 3D permet en outre la formation d'un FEMIE blindé, fournissant un blindage et une utilisation volumétrique améliorée à moindre/sans réduction des performances du système ou augmentation de la hauteur Z du système.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)