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1. (WO2017172203) FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE

Pub. No.:    WO/2017/172203    International Application No.:    PCT/US2017/020147
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Thu Mar 02 00:59:59 CET 2017
IPC: H05K 9/00
Applicants: INTEL CORPORATION
Inventors: YONG, Khang Choong
HALL, Stephen H.
CHUAH, Tin Poay
KOH, Boon Ping
GOH, Eng Huat
Title: FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE
Abstract:
Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.