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1. (WO2017172059) PIEZOELECTRIC PACKAGE-INTEGRATED SWITCHING DEVICES
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Pub. No.: WO/2017/172059 International Application No.: PCT/US2017/017226
Publication Date: 05.10.2017 International Filing Date: 09.02.2017
IPC:
H01H 57/00 (2006.01) ,H01L 41/09 (2006.01) ,H01L 41/047 (2006.01) ,H01L 41/083 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
H
ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
57
Electrostrictive relays; Piezo-electric relays
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
09
with electrical input and mechanical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
of piezo-electric or electrostrictive elements
047
Electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
083
having a stacked or multilayer structure
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
DOGIAMIS, Georgios C.; US
EID, Feras; US
ELSHERBINI, Adel A.; US
NAIR, Vijay K.; US
KAMGAING, Telesphor; US
RAO, Valluri R.; US
SWAN, Johanna M.; US
Agent:
BRASK, Justin, K.; US
Priority Data:
15/088,98201.04.2016US
Title (EN) PIEZOELECTRIC PACKAGE-INTEGRATED SWITCHING DEVICES
(FR) DISPOSITIFS DE COMMUTATION INTÉGRÉS À UN BOÎTIER PIÉZOÉLECTRIQUE
Abstract:
(EN) Embodiments of the invention include a switching device that includes an electrode, a piezoelectric material coupled to the electrode, and a movable structure (e.g., cantilever, beam) coupled to the piezoelectric material. The movable structure includes a first end coupled to an anchor of a package substrate having organic layers and a second released end positioned within a cavity of the package substrate.
(FR) Selon divers modes de réalisation, l'invention concerne un dispositif de commutation qui comprend une électrode, un matériau piézoélectrique couplé à l'électrode, et une structure mobile (par exemple, porte-à-faux, poutre) accouplée au matériau piézoélectrique. La structure mobile comprend une première extrémité accouplée à une ancre d'un substrat de boîtier comportant des couches organiques, et une seconde extrémité libre positionnée à l'intérieur d'une cavité du substrat de boîtier.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)