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1. (WO2017171889) SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTION FOR 3D PACKAGING

Pub. No.:    WO/2017/171889    International Application No.:    PCT/US2016/025779
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Sun Apr 03 01:59:59 CEST 2016
IPC: H01L 23/12
H01L 23/48
Applicants: INTEL CORPORATION
Inventors: MUTHUR SRINATH, Purushotham Kaushik
MALATKAR, Pramod
AGRAHARAM, Sairam
JHA, Chandra M.
CHOUDHURY, Arnab
RARAVIKAR, Nachiket R.
Title: SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTION FOR 3D PACKAGING
Abstract:
In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces therein; a first layer functional silicon die electrically interfaced to the electrical traces of the substrate layer, the first layer functional silicon die having a first thermal pad integrated thereupon; a second layer functional silicon die positioned above the first layer functional silicon die, the second layer functional silicon die having a second thermal pad integrated thereupon; and a conductivity layer positioned between the first layer functional silicon die and the second layer functional silicon die, wherein the conductivity layer is to: (i) electrically join the second layer functional silicon die to the first layer functional silicon die and (ii) bond the first thermal pad of the first layer functional silicon die to the second thermal pad of the second layer functional silicon die via solder. Other related embodiments are disclosed.