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1. (WO2017171872) LAYERED SUBSTRATE FOR MICROELECTRONIC DEVICES

Pub. No.:    WO/2017/171872    International Application No.:    PCT/US2016/025723
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Sat Apr 02 01:59:59 CEST 2016
IPC: H01L 29/78
H01L 21/336
Applicants: INTEL CORPORATION
Inventors: GLASS, Glenn A.
MURTHY, Anand S.
Title: LAYERED SUBSTRATE FOR MICROELECTRONIC DEVICES
Abstract:
The present disclosure provides systems and methods for a layered substrate. A layered substrate may include a core comprising graphite. The layered substrate may also include a coating layer comprising a coating material that surrounds the core, wherein the coating material has a melting point that is greater than a melting point of silicon.