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Machine translation
1. (WO2017171367) SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/171367    International Application No.:    PCT/KR2017/003353
Publication Date: 05.10.2017 International Filing Date: 28.03.2017
IPC:
H01L 23/14 (2006.01), C09J 11/04 (2006.01), C09J 133/10 (2006.01), C09J 133/08 (2006.01), C09J 163/00 (2006.01), C09J 7/00 (2006.01), H01L 23/00 (2006.01), H01L 21/60 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: KIM, Jung Hak; (KR).
KIM, Hee Jung; (KR).
NAM, Seung Hee; (KR).
LEE, Kwang Joo; (KR).
KIM, Se Ra; (KR).
KIM, Young Kook; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro Gangnam-gu Seoul 06134 (KR)
Priority Data:
10-2016-0037214 28.03.2016 KR
Title (EN) SEMICONDUCTOR DEVICE
(FR) DISPOSITIF À SEMI-CONDUCTEURS
(KO) 반도체 장치
Abstract: front page image
(EN)The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight reduction ratio at a high temperature.
(FR)La présente invention concerne un dispositif à semi-conducteurs comprenant : un premier élément semi-conducteur formé sur un support adhésif; et un film adhésif pour intégrer le premier élément semi-conducteur et qui a un rapport prédéterminé entre une viscosité à l'état fondu et un taux de perte de poids à température élevée.
(KO)본 발명은, 피착체 상에 형성된 제1반도체 소자; 및 상기 제1반도체 소자를 매립하는 접착 필름;을 포함하고 상기 접착 필름이 고온에서의 용융점도 및 중량 감소 비율 간의 소정의 비율을 만족하는 반도체 장치에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)