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1. (WO2017170844) THERMOSETTING RESIN COMPOSITION, PREPREG AND CURED PRODUCT THEREOF
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Pub. No.: WO/2017/170844 International Application No.: PCT/JP2017/013196
Publication Date: 05.10.2017 International Filing Date: 30.03.2017
IPC:
C08L 65/00 (2006.01) ,C08F 22/40 (2006.01) ,C08G 61/02 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
65
Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
22
Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
36
Amides or imides
40
Imides, e.g. cyclic imides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
61
Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
02
Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
Applicants:
日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP/JP]; 東京都千代田区丸の内二丁目1番1号 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005, JP
Inventors:
松浦 一貴 MATSUURA Kazuki; JP
中西 政隆 NAKANISHI Masataka; JP
藤田 知樹 FUJITA Tomoki; JP
Agent:
特許業務法人 信栄特許事務所 SHIN-EI PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング8階 Toranomon East Bldg. 8F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2016-07450001.04.2016JP
Title (EN) THERMOSETTING RESIN COMPOSITION, PREPREG AND CURED PRODUCT THEREOF
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE, PRÉIMPRÉGNÉ ET PRODUIT DURCI CORRESPONDANT
(JA) 熱硬化性樹脂組成物、プリプレグ及びその硬化物
Abstract:
(EN) Provided is a thermosetting resin composition which can be molded at relatively low temperatures, and which exhibits excellent heat resistance, mechanical strength, toughness and thermal decomposition properties after curing. This thermosetting resin composition contains: a compound (A) represented by formula (1) and having a maleimide group; and a compound (B) having an allyl group or a methallyl group. (In formula (1), each of the plurality of R1 moieties is independently present and represents a hydrogen atom, an alkyl group having 1-10 carbon atoms or an aromatic group; a represents a number of 1-3; and n represents an integer having an average satisfying 1 < n ≤ 5.)
(FR) L'invention concerne une composition de résine thermodurcissable qui peut être moulée à des températures relativement basses et qui présente d'excellentes propriétés de résistance à la chaleur, de résistance mécanique, de ténacité et de décomposition thermique après durcissement. Cette composition de résine thermodurcissable contient : un composé (A) représenté par la formule (1) et présentant un groupe maléimide ; et un composé (B) présentant un groupe allyle ou un groupe méthallyle. (Dans la formule (1), chacun de la pluralité de fragments R1 est présent indépendamment et représente un atome d'hydrogène, un groupe alkyle comprenant 1 à 10 atomes de carbone ou un groupe aromatique ; a représente un nombre de 1 à 3 ; et n représente un entier présentant une moyenne satisfaisant à 1 < n ≤ 5).
(JA) 比較的に低温で成形加工することが可能であり、さらには硬化後の耐熱性及び機械強度、強靭性、熱分解特性に優れる熱硬化性樹脂組成物を提供する。下記式(1)で表されるマレイミド基を有する化合物(A)と、アリル基またはメタリル基を有する化合物(B)を含有する。 (式(1)中、複数存在するRはそれぞれ独立して存在し、水素原子、炭素数1~10のアルキル基もしくは芳香族基を表す。aは1~3を表す。nは整数でありその平均値は1<n≦5を表す。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)