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1. (WO2017170600) PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/170600    International Application No.:    PCT/JP2017/012743
Publication Date: 05.10.2017 International Filing Date: 28.03.2017
IPC:
G03F 7/027 (2006.01), G03F 7/004 (2006.01), G03F 7/031 (2006.01)
Applicants: ASAHI KASEI KABUSHIKI KAISHA [JP/JP]; 1-105, Kanda Jinbocho, Chiyoda-ku, Tokyo 1018101 (JP)
Inventors: YORISUE, Tomohiro; (JP).
INOUE, Taihei; (JP).
IDO, Yoshito; (JP).
NAKAMURA, Mitsutaka; (JP).
YUNOKUCHI, Tomoshige; (JP).
SASANO, Daisuke; (JP).
SASAKI, Takahiro; (JP)
Agent: AOKI, Atsushi; (JP).
ISHIDA, Takashi; (JP).
KOGA, Tetsuji; (JP).
NAKAMURA, Kazuhiro; (JP).
SAITO, Miyako; (JP).
MIMA, Shunsuke; (JP)
Priority Data:
2016-073576 31.03.2016 JP
2016-084497 20.04.2016 JP
2016-085535 21.04.2016 JP
2016-086482 22.04.2016 JP
2016-094177 09.05.2016 JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, PROCÉDÉ POUR FABRIQUER UN MOTIF EN RELIEF DURCI ET APPAREIL À SEMI-CONDUCTEUR
(JA) 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
Abstract: front page image
(EN)A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
(FR)Une composition de résine photosensible contenant une résine et un composé ayant chacun une structure spécifiée par la présente invention fournit un film durci ayant une excellente adhésivité au câblage de cuivre.
(JA)本明細書において特定される構造を有する樹脂及び化合物を含む感光性樹脂組成物が、銅配線への接着性に優れた硬化膜を与える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)