Search International and National Patent Collections

1. (WO2017170521) RESIN COMPOSITION AND MULTILAYER SUBSTRATE

Pub. No.:    WO/2017/170521    International Application No.:    PCT/JP2017/012593
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Mar 29 01:59:59 CEST 2017
IPC: C08G 59/26
C08G 59/42
H05K 1/03
H05K 3/46
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: HAYASHI, Tatsushi
林 達史
BABA, Susumu
馬場 奨
Title: RESIN COMPOSITION AND MULTILAYER SUBSTRATE
Abstract:
Provided is a resin composition which is capable of improving desmear properties, and which is also capable of providing a cured product that has a low dielectric loss tangent and high heat resistance. A resin composition according to the present invention contains an active ester compound and a compound having a structure represented by formula (1), a structure obtained by bonding a substituent to a benzene ring of the structure represented by formula (1), a structure represented by formula (2), a structure obtained by bonding a substituent to a benzene ring of the structure represented by formula (2), a structure represented by formula (3), a structure obtained by bonding a substituent to a benzene ring of the structure represented by formula (3), a structure represented by formula (4) or a structure obtained by bonding a substituent to a benzene ring of the structure represented by formula (4). In this connection, the structure represented by formula (1), (2), (3) or (4) has: a phenylene group or a naphthylene group; and a heteroatom, a group wherein a hydrogen atom is bonded to a heteroatom, or a carbonyl group.