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1. (WO2017170438) MASK INTEGRATED-TYPE SURFACE PROTECTION TAPE

Pub. No.:    WO/2017/170438    International Application No.:    PCT/JP2017/012457
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Tue Mar 28 01:59:59 CEST 2017
IPC: H01L 21/301
B23K 26/361
H01L 21/304
Applicants: FURUKAWA ELECTRIC CO., LTD.
古河電気工業株式会社
Inventors: GOTO, Yusuke
五島 裕介
Title: MASK INTEGRATED-TYPE SURFACE PROTECTION TAPE
Abstract:
A mask integrated-type surface protection tape for use in the manufacture of a semiconductor chip including steps (a) to (d) below. The mask integrated-type surface protection tape comprises, on a base material film and in this order, a radiation curing adhesive layer and a radiation curing mask material layer, wherein, in step (b) below, the adhesive layer and the mask material layer are peelable prior to irradiation, and the mask material layer and a pattern surface are peelable after irradiation. Steps (a) to (d) (a) a step of grinding a back surface of a semiconductor wafer with the mask integrated-type surface protection tape affixed to a pattern surface side of the semiconductor wafer, affixing a wafer fixing tape to the back surface of the ground semiconductor wafer, and supporting/fixing the wafer fixing tape using a ring frame; (b) after the base material film and the adhesive layer have been peeled together from the mask integrated-type surface protection tape, thereby exposing the mask material layer at the surface, a step of using a laser to cut portions of the mask material layer that correspond to streets of the semiconductor wafer, to open the semiconductor wafer streets; (c) a plasma dicing step of cutting the semiconductor wafer along the streets using SF6 plasma to form individual semiconductor chips; and (d) an ashing step of removing the mask material layer using O2 plasma.