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1. (WO2017169958) ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING

Pub. No.:    WO/2017/169958    International Application No.:    PCT/JP2017/011134
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Mar 22 00:59:59 CET 2017
IPC: H01L 21/304
H01L 21/683
Applicants: MITSUI CHEMICALS TOHCELLO, INC.
三井化学東セロ株式会社
Inventors: KURIHARA Hiroyoshi
栗原 宏嘉
FUKUMOTO Hideki
福本 英樹
Title: ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING
Abstract:
This adhesive film (100) for semiconductor wafer processing is provided with a base material layer (10) and a UV curable adhesive resin layer (20) on one side of the base material layer (10), and is used in order to protect the surface of a semiconductor wafer or to fix the semiconductor wafer. Further, in this adhesive film (100), the adhesive resin layer (20) includes a UV curable adhesive resin, and, after UV curing, has a 2.0 kV or lower saturated charge voltage V1, measured by the method below. (Method) A high-pressure mercury lamp in a 25°C environment is used to irradiate and optically cure the adhesive resin layer (20) with UV rays having a dominant wavelength of 365 nm, an irradiation intensity of 100 mW/cm2 and a UV dose of 1080 mJ/cm2. Subsequently, a voltage is applied to the surface of the adhesive resin layer (20) for 30 seconds under the conditions of a 10 kV applied voltage, a 20 mm distance between the sample and electrode, 25°C, and 50% RH, and the saturated charge voltage (V1) of the surface of the adhesive resin layer (20) is calculated in conformity with JIS L1094.