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1. (WO2017169881) SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INTEGRATED SUBSTRATE, AND ELECTRONIC APPARATUS

Pub. No.:    WO/2017/169881    International Application No.:    PCT/JP2017/010862
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Sat Mar 18 00:59:59 CET 2017
IPC: H01L 23/02
H01L 23/00
H01L 23/12
Applicants: SONY CORPORATION
ソニー株式会社
Inventors: YAMAMOTO Yuichi
山本 雄一
Title: SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INTEGRATED SUBSTRATE, AND ELECTRONIC APPARATUS
Abstract:
The present art relates to a semiconductor device enabling to improve moisture resistance of the semiconductor device, a method for manufacturing the semiconductor device, an integrated substrate, and an electronic apparatus. A semiconductor device of the present art is provided with: a semiconductor chip; and a protection member, which is transparent and moisture resistant, and which covers the side surfaces of the semiconductor chip, and at least one of a first surface, which is perpendicular to the side surfaces, and a second surface on the reverse side of the first surface. An electronic apparatus of the present art is provided with the semiconductor device, and a signal processing unit. The present art can be applied to, for instance, an image pickup element, and an electronic apparatus provided with the image pickup element.