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1. (WO2017169747) FILM FOR COMPONENT MANUFACTURE AND COMPONENT MANUFACTURING METHOD

Pub. No.:    WO/2017/169747    International Application No.:    PCT/JP2017/010253
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Mar 15 00:59:59 CET 2017
IPC: H01L 21/301
C09J 7/02
C09J 201/00
H01L 21/683
Applicants: MITSUI CHEMICALS TOHCELLO, INC.
三井化学東セロ株式会社
Inventors: HAYASHISHITA Eiji
林下 英司
Title: FILM FOR COMPONENT MANUFACTURE AND COMPONENT MANUFACTURING METHOD
Abstract:
[Problem] To provide a film for manufacture of a semiconductor component and a film for manufacture of an electronic component which, even when used in an environment with a changing temperature, can be easily removed from a table surface after stopping suction and which can stabilize the state of adhesion to the table surface. Furthermore, a semiconductor component manufacturing method using said semiconductor component manufacturing film, and an electronic component manufacturing method using said electronic component manufacturing film are provided. [Solution] This component manufacturing film 1, which is used in a method for manufacturing a semiconductor component or an electronic component, is provided with a base layer 11 and an adhesion material layer 12 provided on one surface 11a of the base layer, wherein the surface of the base layer on which the adhesive material layer is not disposed has an Ra (μm) of 0.1-2.0 and an Rz (μm) of 1.0-15. This method uses the component manufacturing film 1, involves a singulation step and a pickup step, and involves an evaluation step before the pickup step.