Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017169387) FILM ADHESIVE, SEMICONDUCTOR PROCESSING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/169387 International Application No.: PCT/JP2017/007083
Publication Date: 05.10.2017 International Filing Date: 24.02.2017
IPC:
H01L 21/301 (2006.01) ,B23K 26/53 (2014.01) ,C09J 7/02 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
[IPC code unknown for B23K 26/53]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
仲秋 なつき NAKAAKI Natsuki; JP
佐藤 明徳 SATO Akinori; JP
土山 さやか TSUCHIYAMA Sayaka; JP
鈴木 英明 SUZUKI Hideaki; JP
Agent:
志賀 正武 SHIGA Masatake; JP
高橋 詔男 TAKAHASHI Norio; JP
五十嵐 光永 IGARASHI Koei; JP
Priority Data:
2016-06960430.03.2016JP
Title (EN) FILM ADHESIVE, SEMICONDUCTOR PROCESSING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
(FR) ADHÉSIF DE FILM, FEUILLE DE TRAITEMENT DE SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION D'APPAREIL À SEMI-CONDUCTEUR
(JA) フィルム状接着剤、半導体加工用シート及び半導体装置の製造方法
Abstract:
(EN) A film adhesive (13) according to the present invention is a curable film adhesive. A single layer of the film adhesive (13) that has a thickness of 60 µm and that is uncured, or a laminate formed by stacking two or more layers of the film adhesive (13), which is uncured, so as to have a total thickness of 60 µm, has a rupture elongation of 60% or less at the temperature of 0°C, and the adhesiveness of the uncured film adhesive (13) to a semiconductor wafer is 300 mN/25 mm or higher. A semiconductor processing sheet (1) according to the present invention is formed by providing the film adhesive (13) on a support sheet (10) having a base material (11).
(FR) Un adhésif de film (13) selon la présente invention est un adhésif de film durcissable. Une couche unique de l'adhésif de film (13) qui a une épaisseur de 60 µm et qui n'est pas durcie, ou un stratifié formé par empilement de deux couches ou plus de l'adhésif de film (13), qui n'est pas durci, de façon à avoir une épaisseur totale de 60 µm, a un allongement à la rupture inférieur ou égal à 60 % à la température de 0 °C, et l'adhésivité de l'adhésif de film (13) non durci à une tranche de semi-conducteur est supérieure ou égale à 300 mN/25 mm. Une feuille de traitement de semi-conducteur (1) selon la présente invention est formée en utilisant l'adhésif de film (13) sur une feuille de support (10) ayant un matériau de base (11).
(JA) 本発明のフィルム状接着剤(13)は、硬化性のフィルム状接着剤であって、厚さが60μmである硬化前の単層のフィルム状接着剤(13)、又は硬化前の2層以上のフィルム状接着剤(13)を、合計の厚さが60μmとなるように積層した積層体の、0℃における破断伸度が60%以下であり、硬化前のフィルム状接着剤(13)の半導体ウエハに対する接着力が300mN/25mm以上である。本発明の半導体加工用シート(1)は、基材(11)を有する支持シート(10)上に、フィルム状接着剤(13)が設けられている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)