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1. (WO2017169314) SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
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Pub. No.: WO/2017/169314 International Application No.: PCT/JP2017/006448
Publication Date: 05.10.2017 International Filing Date: 22.02.2017
IPC:
H01L 27/146 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1 Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
澁田 宏和 SHIBUTA Hirokazu; JP
Agent:
渡邊 薫 WATANABE Kaoru; JP
Priority Data:
2016-07344531.03.2016JP
Title (EN) SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
(FR) ÉLÉMENT D'IMAGERIE EN SEMICONDUCTEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) 固体撮像素子、及び電子装置
Abstract:
(EN) To provide a backside-illuminated solid-state imaging element which is capable of improving image quality. Provided is a backside-illuminated solid-state imaging element which is provided at least with a semiconductor substrate, an organic photoelectric conversion film that is formed above one of the front and back surfaces of the semiconductor substrate, and an optical waveguide that is formed between the semiconductor substrate and the organic photoelectric conversion film.
(FR) L'invention vise à produire un élément d'imagerie en semiconducteur éclairé par l'arrière qui est capable d'améliorer la qualité d'image. L'invention concerne un élément d'imagerie en semiconducteur éclairé par l'arrière qui comprend au moins un substrat en semiconducteur, un film de conversion photoélectrique organique qui est formé au-dessus de l'une des surfaces avant et arrière du substrat en semiconducteur, et un guide d'ondes optique qui est formé entre le substrat en semiconducteur et le film de conversion photoélectrique organique.
(JA) 画質を向上させることができる裏面照射型の固体撮像素子を提供すること。 半導体基板と、該半導体基板の表裏面のうちの一方の面側に形成されている有機光電変換膜と、該半導体基板と該有機光電変換膜との間に形成されている光導波路と、を少なくとも備える、裏面照射型の固体撮像素子を提供する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)