Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017169134) POWER MODULE, METHOD FOR MANUFACTURING POWER MODULE, POWER ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING POWER ELECTRONIC APPARATUS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/169134 International Application No.: PCT/JP2017/004372
Publication Date: 05.10.2017 International Filing Date: 07.02.2017
IPC:
H01L 25/07 (2006.01) ,H01L 23/48 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
曽田 真之介 SODA, Shinnosuke; JP
小林 浩 KOBAYASHI, Hiroshi; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2016-06878630.03.2016JP
Title (EN) POWER MODULE, METHOD FOR MANUFACTURING POWER MODULE, POWER ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING POWER ELECTRONIC APPARATUS
(FR) BLOC D'ALIMENTATION ET SON PROCÉDÉ DE FABRICATION, APPAREIL ÉLECTRONIQUE D'ALIMENTATION ET SON PROCÉDÉ DE FABRICATION
(JA) パワーモジュール及びその製造方法並びにパワーエレクトロニクス機器及びその製造方法
Abstract:
(EN) A power module (1) is provided with: a first power semiconductor element (40) including a first electrode (44); a resin frame (20) including first receiving sections (24, 27); and a first lead frame (50). The first lead frame (50) has a first main surface (53) facing the first electrode (44), and is electrically and mechanically connected to the first electrode (44). The first receiving sections (24, 27) face the first main surface (53) of the first lead frame (50), and receive a part of the first lead frame (50). Consequently, it is made possible that the power module (1) has high reliability and reduced sizes.
(FR) L'invention concerne un bloc d'alimentation (1) qui est pourvu : d'un premier composant à semi-conducteurs d'alimentation (40) comprenant une première électrode (44); d'un cadre en résine (20) comprenant des premières sections de réception (24, 27); d'une première grille de connexion (50). La première grille de connexion (50) possède une première surface principale (53) tournée vers la première électrode (44), et est connectée électriquement et mécaniquement à celle-ci (44). Les premières sections de réception (24, 27) sont tournées vers la première surface principale (53) de la première grille de connexion (50), et reçoivent une partie de la première grille de connexion (50). Par conséquent, grâce à la présente invention, le bloc d'alimentation (1) possède une fiabilité élevée et des dimensions réduites.
(JA) パワーモジュール(1)は、第1の電極(44)を含む第1のパワー半導体素子(40)と、第1の受容部(24,27)を含む樹脂フレーム(20)と、第1のリードフレーム(50)とを備える。第1のリードフレーム(50)は、第1の電極(44)に対向する第1の主面(53)を有し、かつ、第1の電極(44)に電気的及び機械的に接続される。第1の受容部(24,27)は、第1のリードフレーム(50)の第1の主面(53)に対向し、第1のリードフレーム(50)の一部を受け入れる。そのため、パワーモジュール(1)は、高い信頼性を有するとともに、小型化され得る。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)