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1. (WO2017169019) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Pub. No.:    WO/2017/169019    International Application No.:    PCT/JP2017/002403
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Jan 25 00:59:59 CET 2017
IPC: H01L 21/304
H01L 21/306
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: KANEMATSU, Yasunori
金松 泰範
NAKAI, Hitoshi
中井 仁司
IWATA, Tomomi
岩田 智巳
Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Abstract:
In the present invention, the processing of a substrate (9) having a structure formed on the top surface (91) thereof includes: a process whereby a liquid film of an organic solvent is held on the top surface (91) so that gaps in the structure are filled by the organic solvent, and a filling agent is then supplied in order to substitute the organic solvent with the filling agent; and a process whereby any filling agent attached to the outer edges of the substrate (9) is removed. A guard part (25) moves up and down such that the annular clearance, which is defined as the minimum clearance formed in an annular shape between the inner surface of the guard part (25) and the outer edge of the substrate (9), has a width that is greater in the former process than the width in the latter process. This reduces the gas flow rate near the outer edges of the substrate (9) during holding of the liquid film, thereby inhibiting destruction etc. of the liquid film, and increases the gas flow rate from near the outer edges toward the annular clearance during cleaning of the outer edges of the substrate (9), thereby inhibiting cleaning liquid etc. that has scattered from the substrate (9) from returning to the substrate (9).