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1. (WO2017169018) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Pub. No.:    WO/2017/169018    International Application No.:    PCT/JP2017/002402
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Jan 25 00:59:59 CET 2017
IPC: H01L 21/304
H01L 21/027
H01L 21/306
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: NAKAI, Hitoshi
中井 仁司
KANEMATSU, Yasunori
金松 泰範
ANDO, Koji
安藤 幸嗣
IWATA, Tomomi
岩田 智巳
Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Abstract:
According to the present invention, pure water, a liquid mixture, and an organic solvent are sequentially supplied onto a top surface (91) while a substrate (9) rotates at a relatively high rotation speed so that the liquid splashing from the top surface (91) is received by the inner surface of an outside cup part (25) during an outside cup facing state in which the upper end of an inside cup part (24) is disposed lower than the upper end of the outside cup part (25). Next, a filler solution is supplied onto the top surface (91) and the top surface (91) is covered with the filler solution during an inside cup facing state in which the inner surface of the inside cup part (24) is disposed around the substrate (9). Consequently, mixing of the filler solution and the pure water inside the inside cup part (24) is prevented and gelling and the like of the filler solution is also prevented. By supplying the liquid mixture in which the organic solvent and the pure water are mixed, the collapse of pattern elements formed on the top surface (91) is suppressed.