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1. (WO2017168925) JOINT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/168925 International Application No.: PCT/JP2017/000474
Publication Date: 05.10.2017 International Filing Date: 10.01.2017
IPC:
H01L 21/52 (2006.01) ,B23K 35/26 (2006.01) ,H01L 23/36 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
26
with the principal constituent melting at less than 400C
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
鷲塚 清多郎 WASHIZUKA, Seitaro; JP
Agent:
特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES; 大阪府大阪市淀川区宮原3丁目5番36号 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2016-06440728.03.2016JP
Title (EN) JOINT
(FR) ARTICULATION
(JA) 接合体
Abstract:
(EN) This joint is a joint by which a first member and a second member are joined via a joining part, the joint characterized in that the joining part contains an intermetallic compound of a first metal, and a second metal having a higher melting point than the first metal; the first metal is Sn or an Sn alloy; the second metal is a Cu alloy; a heat conducting part containing the second metal exists between the first member and the second member; and the first member is in contact with the joining part and the heat conducting part.
(FR) Articulation qui est une articulation par laquelle un premier élément et un second élément sont reliés par l'intermédiaire d'une partie de liaison, l'articulation étant caractérisée en ce que la partie de liaison contient un composé intermétallique d'un premier métal et d'un second métal ayant un point de fusion plus élevé que celui du premier métal ; le premier métal est du Sn ou un alliage de Sn ; le second métal est un alliage de Cu ; une partie conductrice de chaleur contenant le second métal existe entre le premier élément et le second élément ; et le premier élément est en contact avec la partie de liaison et la partie conductrice de chaleur.
(JA) 本発明の接合体は、第1部材と第2部材とが接合部を介して接合された接合体であって、上記接合部は、第1金属と、上記第1金属よりも融点の高い第2金属との金属間化合物を含み、上記第1金属は、Sn又はSn合金であり、上記第2金属は、Cu合金であり、上記第1部材と上記第2部材との間には、上記第2金属を含む伝熱部が存在し、上記第1部材は、上記接合部及び上記伝熱部と接していることを特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)