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1. (WO2017168675) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR LOADING SUBSTRATE, AND RECORDING MEDIUM

Pub. No.:    WO/2017/168675    International Application No.:    PCT/JP2016/060652
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Fri Apr 01 01:59:59 CEST 2016
IPC: H01L 21/31
C23C 16/44
H01L 21/677
Applicants: KOKUSAI ELECTRIC CORPORATION
株式会社KOKUSAI ELECTRIC
Inventors: KAGA, Yukinao
加我友紀直
YOSHIDA, Ryosuke
吉田怜亮
Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR LOADING SUBSTRATE, AND RECORDING MEDIUM
Abstract:
[Problem] To provide a technique that enables a decrease in the influence of the surface area per large-surface-area substrate and the number of loaded substrates, thus achieving superior film thickness uniformity across substrate loading regions, when large-surface-area substrates are processed in a batch furnace. [Solution] The present invention has: a step for loading large-surface-area substrates in a distributed manner, wherein, with a substrate support that is provided with substrate loading regions having a plurality of slots, that supports a plurality of substrates by having the substrates loaded into the slots, and that has a maximum number of loaded substrates of X (X≥3), when the substrate support is loaded with Y (Y