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1. (WO2017168513) SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM

Pub. No.:    WO/2017/168513    International Application No.:    PCT/JP2016/059909
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Tue Mar 29 01:59:59 CEST 2016
IPC: H01L 21/31
C23C 16/44
H01L 21/318
Applicants: KOKUSAI ELECTRIC CORPORATION
株式会社KOKUSAI ELECTRIC
Inventors: HANASHIMA, Takeo
花島 建夫
KAMAKURA, Tsukasa
鎌倉 司
SASAKI, Takafumi
佐々木 隆史
YOSHIDA, Hidenari
吉田 秀成
Title: SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM
Abstract:
[Problem] To provide a technique to improve inter-plane uniformity. [Solution] A substrate processing device is provided with: a processing chamber that internally houses a substrate holding tool for holding a plurality of substrates in a multistage manner and processes the substrates; a supply buffer portion that is adjacent to the processing chamber; a material gas supply portion placed inside the supply buffer portion; and a reactive gas supply portion placed inside the supply buffer portion. The material gas supply portion is configured so as to supply a material gas into the supply buffer portion from a position lower than or equal to the height of the substrate placed at the lowest stage of the substrate holding tool.