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1. (WO2017168342) COMPONENT EMBEDDING IN THINNER CORE USING DIELECTRIC SHEET
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Pub. No.: WO/2017/168342 International Application No.: PCT/IB2017/051794
Publication Date: 05.10.2017 International Filing Date: 29.03.2017
IPC:
H05K 1/18 (2006.01) ,H05K 3/30 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
Applicants:
AT&S (CHINA) CO. LTD. [CN/CN]; No. 5000, Jin Du Road Xinzhuang Industry Park Minhang District Shanghai 201108, CN
Inventors:
TAY, Annie; SG
TUOMINEN, Mikael; CN
Priority Data:
201610196443.131.03.2016CN
Title (EN) COMPONENT EMBEDDING IN THINNER CORE USING DIELECTRIC SHEET
(FR) INTÉGRATION DE COMPOSANT DANS UN NOYAU PLUS MINCE À L'AIDE D'UNE FEUILLE DIÉLECTRIQUE
Abstract:
(EN) A component carrier (400), comprising a core (100) having a recess (102), at least one electronic component (306) arranged in the recess (102), wherein a vertical thickness (D) of the at least one electronic component (306) is larger than a vertical thickness (d) of the core (100), and an electrically insulating sheet (402) covering at least part of a top main surface (110) of the core (100), covering at least part of the at least one electronic component (306) and filling a gap between a lateral surface (300) of the at least one electronic component (306) and a lateral surface (104) of the core (100) in the recess (102).
(FR) Un support de composant (400), comprenant un noyau (100) ayant un évidement (102), au moins un composant électronique (306) disposé dans l'évidement (102), l'épaisseur verticale (D) du ou des composants électroniques (306) étant supérieure à l'épaisseur verticale (d) du noyau (100), et une feuille électriquement isolante (402) recouvrant au moins une partie d'une surface principale supérieure (110) du noyau (100), recouvrant au moins une partie du ou des composants électroniques (306) et remplissant un espace entre une surface latérale (300) du ou des composants électroniques (306) et une surface latérale (104) du noyau (100) dans l'évidement (102).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)