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1. (WO2017168323) ELECTRONIC COMPONENT EMBEDDED BY LAMINATED SHEET

Pub. No.:    WO/2017/168323    International Application No.:    PCT/IB2017/051769
Publication Date: Fri Oct 06 01:59:59 CEST 2017 International Filing Date: Wed Mar 29 01:59:59 CEST 2017
IPC: H05K 1/18
Applicants: AT&S (CHINA) CO. LTD.
Inventors: TAY, Annie
TUOMINEN, Mikael
Title: ELECTRONIC COMPONENT EMBEDDED BY LAMINATED SHEET
Abstract:
A component carrier (400) comprising a core (100) having a recess (102), an electronic component (306) arranged in the recess (102), a laminated electrically insulating sheet (402) covering at least part of the core (100) and of the electronic component (306) and filling a gap between a lateral surface (300) of the electronic component (306) and a lateral surface (104) of the core (100) in the recess (102), and a further electrically insulating layer structure (600) laminated on top of the sheet (402).