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1. (WO2017168261) EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/168261 International Application No.: PCT/IB2017/000680
Publication Date: 05.10.2017 International Filing Date: 27.03.2017
IPC:
H05K 1/11 (2006.01) ,H05K 3/22 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants: ALCATEL LUCENT[FR/FR]; 148/152 Route de la Reine 92100 Boulogne-billancourt, FR
Inventors: SCHRIEL, James Michael; CA
CHAN, Alex; CA
BROWN, Paul James; CA
Agent: SARUP, David Alexander; GB
Priority Data:
15/082,68228.03.2016US
Title (EN) EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY
(FR) TAMPONS ALLONGÉS POUR FACILITER LE RÉUSINAGE POUR TECHNOLOGIE DE TYPE À COMPOSANTS DE TERMINAISON INFÉRIEURE ET BOÎTIER À BILLES
Abstract:
(EN) Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a surface mount component including: a plurality of metal pads on the surface of one side of the PCB corresponding to connection points on the component, wherein at least a portion of the plurality of metal pads have stubs which extend outside the boundary of the surface mount component when the surface mount component is mounted to the PCB; and wherein the stubs have sufficient thermal conductivity to facilitate at least one of the set of dismounting and reattaching of the surface mount component.
(FR) Selon divers modes de réalisation donnés à titre d'exemple, cette invention concerne une carte de circuit imprimé (PCB) pour connecter électriquement un composant de montage en surface comprenant : une pluralité de plots métalliques sur la surface d'un côté de la carte de circuit imprimé correspondant à des points de connexion sur le composant, au moins une partie de la pluralité de plots métalliques possédant des bouts qui s'étendent à l'extérieur de la limite du composant de montage en surface lorsque le composant de montage en surface est monté sur la carte de circuit imprimé ; et les bouts présentant une conductivité thermique suffisante pour faciliter au moins l'un du démontage et du repositionnement du composant de montage en surface.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)