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1. (WO2017167987) MICROWAVE ANTENNA APPARATUS, PACKING AND MANUFACTURING METHOD
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Pub. No.: WO/2017/167987 International Application No.: PCT/EP2017/057743
Publication Date: 05.10.2017 International Filing Date: 31.03.2017
IPC:
H01Q 1/22 (2006.01) ,H01P 5/107 (2006.01) ,H01Q 9/04 (2006.01) ,H01Q 9/27 (2006.01) ,H01Q 9/42 (2006.01) ,H01Q 11/08 (2006.01) ,H01Q 15/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5
Coupling devices of the waveguide type
08
for linking lines or devices of different kinds
10
for coupling balanced with unbalanced lines or devices
107
Hollow-waveguide/strip-line transitions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
16
with feed intermediate between the extremities of the aerial, e.g. centre-fed dipole
26
with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
27
Spiral aerials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
30
with feed to end of elongated active element, e.g. unipole
42
with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
11
Electrically-long aerials having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
02
Non-resonant aerials, e.g. travelling-wave aerial
08
Helical aerials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
15
Devices for reflection, refraction, diffraction, or polarisation of waves radiated from an aerial, e.g. quasi-optical devices
Applicants:
SONY CORPORATION [JP/JP]; 1-7-1 Konan Minato-Ku Tokyo, 108-0075, JP
SONY EUROPE LIMITED [GB/GB]; The Heights, Brooklands Weybridge Surrey KT13 0XW, GB (AL)
Inventors:
KHAN, Wasif, Tanveer; PK
TOPAK, Ali Eray; NL
OTT, Arndt Thomas; DE
Agent:
WITTE, WELLER & PARTNERPATENTANWÄLTE MBB; Postfach 10 54 62 70047 Stuttgart, DE
Priority Data:
16163516.401.04.2016EP
Title (EN) MICROWAVE ANTENNA APPARATUS, PACKING AND MANUFACTURING METHOD
(FR) APPAREIL D'ANTENNE À MICRO-ONDES, EMBALLAGE ET PROCÉDÉ DE FABRICATION
Abstract:
(EN) A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB)or embedded micro-wafer-level-packaging (emWLP) package.
(FR) L'invention concerne un appareil d'antenne à micro-ondes comprenant un élément semi-conducteur et un élément d'antenne incorporé dans une couche de moulage, qui est recouverte par une couche de redistribution. L'élément d'antenne se présente de préférence sous la forme d'un composant SMD de sorte qu'il puisse être manipulé par un processus de prise et de placement standard. Le couplage entre l'élément semi-conducteur et l'élément d'antenne est assuré soit par une couche métallique soit par un couplage d'ouverture dans la couche de redistribution. L'appareil d'antenne à micro-ondes peut être couplé à un agencement de PCB, formant ainsi un réseau de grille matricielle à billes à niveau de tranche intégré (eWLB) ou un boîtier d'emballage à niveau de micro-tranche intégré (emWLP).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)