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1. (WO2017167875) LAMINATED COMPONENT CARRIER WITH A THERMOPLASTIC STRUCTURE
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Pub. No.: WO/2017/167875 International Application No.: PCT/EP2017/057542
Publication Date: 05.10.2017 International Filing Date: 30.03.2017
IPC:
H05K 1/02 (2006.01) ,H05K 3/46 (2006.01) ,H05K 3/00 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT [AT/AT]; Fabriksgasse 13 8700 Leoben, AT
Inventors:
KRIVEC, Thomas; AT
Agent:
SCHINDELMANN, Peter; DE
Priority Data:
10 2016 105 737.130.03.2016DE
Title (EN) LAMINATED COMPONENT CARRIER WITH A THERMOPLASTIC STRUCTURE
(FR) SUPPORT DE COMPOSANT STRATIFIÉ AVEC STRUCTURE THERMOPLASTIQUE
Abstract:
(EN) A component carrier (890) for carrying at least one electronic component comprises (a) a plurality of electrically conductive layers (204, 206, 432, 434); (b) a plurality of electrically insulating layers (422, 424); and (c) a thermoplastic structure (102) comprising a thermoplastic material. The electrically conductive layers (204, 206, 432, 434), the electrically insulating layers (422, 424), and the thermoplastic structure (102) form a laminate. Further, it is provided a method for manufacturing such a component carrier (890) and an electronic apparatus comprising such a component carrier (890).
(FR) La présente invention concerne un support de composant (890) pour soutenir au moins un composant électronique qui comprend (a) une pluralité de couches électriquement conductrices (204, 206, 432, 434) ; (b) une pluralité de couches électriquement isolantes (422, 424) ; et (c) une structure thermoplastique (102) comprenant un matériau thermoplastique. Les couches électriquement conductrices (204 206, 432, 434), les couches électriquement isolantes (422, 424) et la structure thermoplastique (102) forment un stratifié. En outre, l'invention concerne un procédé de fabrication d'un tel support de composant (890) et un appareil électronique comprenant un tel support de composant (890).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)