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1. WO2017164254 - SUBSTRATE SUPPLY UNIT AND BONDING DEVICE

Publication Number WO/2017/164254
Publication Date 28.09.2017
International Application No. PCT/JP2017/011524
International Filing Date 22.03.2017
IPC
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 13/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
02Feeding of components
H05K 13/04 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
H01L 21/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
52Mounting semiconductor bodies in containers
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
H01L 21/67712
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67712the substrate being handled substantially vertically
H01L 21/67733
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67733Overhead conveying
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
Applicants
  • 株式会社新川 SHINKAWA LTD. [JP]/[JP]
Inventors
  • 小林 泰人 KOBAYASHI, Taito
  • 孝多 正義 KOUTA, Masayoshi
Agents
  • 稲葉 良幸 INABA, Yoshiyuki
  • 大貫 敏史 ONUKI, Toshifumi
Priority Data
2016-05731422.03.2016JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE SUPPLY UNIT AND BONDING DEVICE
(FR) UNITÉ D'ALIMENTATION EN SUBSTRAT ET DISPOSITIF DE LIAISON
(JA) 基板供給ユニット及びボンディング装置
Abstract
(EN) This substrate supply unit is provided with: a body part (110) that is composed of a plurality of decks (42, 44, 46) on three or more levels provided at different positions in a height direction, said decks each accommodating a plurality of substrate accommodating bodies (90) which are arranged in a depth direction which is orthogonal to the height direction; an elevator part (120) that is disposed adjacent to one side of the body part (110) in the depth direction and moves the substrate accommodating bodies (90) up and down in the height direction so as to supply the substrate accommodating bodies (90) to any of the decks; and a substrate transport part (130) that is disposed adjacent to the other side of the body part (110) in the depth direction, wherein the substrate accommodating bodies are taken out of the decks into said substrate transport part (130), which transports the substrates accommodated by the substrate accommodating bodies to a transport lane (30) for bonding. This makes it possible to provide a compact configuration and improve the degree of freedom of processing modes.
(FR) Cette unité d'alimentation en substrat comporte : une partie de corps (110) qui est composée d'une pluralité de ponts (42, 44, 46) sur trois niveaux ou plus disposés à différentes positions dans le sens de la hauteur, lesdits ponts recevant chacun une pluralité de corps de réception de substrat (90) qui sont agencés dans le sens de la profondeur qui est orthogonal au sens de la hauteur ; une partie d'ascenseur (120) qui est disposée adjacente à un côté de la partie de corps (110) dans le sens de la profondeur et qui monte et descend les corps de réception de substrat (90) dans le sens de la hauteur de manière à fournir les corps de réception de substrat (90) à n'importe lequel des ponts ; et une partie de transport de substrat (130) qui est disposée adjacente à l'autre côté de la partie de corps (110) dans le sens de la profondeur, les corps de réception de substrat étant retirés des ponts vers ladite partie de transport de substrat (130), qui transporte les substrats logés dans les corps de réception de substrat vers une voie de transport (30) en vue d'une liaison. Cela permet d'obtenir une configuration compacte et d'améliorer le degré de liberté des modes de traitement.
(JA) 基板供給ユニットは、高さ方向のそれぞれ異なる位置に設けられた3階層以上の複数のデッキ(42,44,46)から構成され、各デッキが高さ方向に直交する奥行方向に配列される複数の基板収容体(90)を収容する、本体部(110)と、本体部(110)における奥行方向の一方側に隣接して配置され、いずれかのデッキに基板収容体(90)を供給するように基板収容体(90)を高さ方向に上下に移動させるエレベータ部(120)と、本体部(110)における奥行方向の他方側に隣接して配置され、いずれかのデッキから基板収容体を取り出し、かつ、基板収容体に収容される基板をボンディング用搬送レーン(30)へ搬送する基板搬送部(130)とを備える。これにより、コンパクトな構成を備えるとともに処理態様の自由度を向上することができる。
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