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1. (WO2017157002) ELECTRONIC APPARATUS, AND MOUNTING ASSEMBLY FOR HEADPHONE SOCKET THEREOF

Pub. No.:    WO/2017/157002    International Application No.:    PCT/CN2016/100833
Publication Date: Fri Sep 22 01:59:59 CEST 2017 International Filing Date: Fri Sep 30 01:59:59 CEST 2016
IPC: H01R 13/74
H04M 1/02
Applicants: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
珠海格力电器股份有限公司
Inventors: ZHENG, Yadong
郑亚东
CHEN, Changkuo
陈长阔
REN, Bin
任斌
XU, Chao
许超
SHAO, Longfei
邵龙飞
Title: ELECTRONIC APPARATUS, AND MOUNTING ASSEMBLY FOR HEADPHONE SOCKET THEREOF
Abstract:
A mounting assembly for a headphone socket. The mounting assembly comprises a headphone socket and a mounting board (3), the mounting board having connection members (2). Connection portions (1) at two sides of the headphone socket are sleeved around and fixed to the connection members (2). In the mounting assembly, the connection portions (1) of the headphone socket are sleeved around the connection members (2) instead of being stacked to the connection members (2). In this way, the connection portions (1) of the headphone socket do not occupy space in an axial direction of the connection members (2), thus reducing the thickness of the headphone socket when the connection portions (1) and the connection members (2) are connected. Therefore, the present invention facilitates thickness reduction of an electronic apparatus having the mounting assembly for a headphone socket, thus enabling the electronic apparatus adaptable to the development trend of the modern technology. Also disclosed is an electronic apparatus having the mounting assembly for a headphone socket.