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1. (WO2017156914) METALIZED LAMINATE AND SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE COMPRISING SAME

Pub. No.:    WO/2017/156914    International Application No.:    PCT/CN2016/087253
Publication Date: Fri Sep 22 01:59:59 CEST 2017 International Filing Date: Tue Jun 28 01:59:59 CEST 2016
IPC: H01L 23/522
H01L 27/00
Applicants: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
中国科学院微电子研究所
Inventors: ZHU, Huilong
朱慧珑
Title: METALIZED LAMINATE AND SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE COMPRISING SAME
Abstract:
Disclosed are a metalized laminate and a semiconductor device and an electronic device comprising same. According to an embodiment of the invention, the metalized laminate comprises: an interlayer dielectric layer comprising a dielectric material and a negative capacitance material, wherein at least one pair of at least partially opposing first conductive interconnected parts formed in the interlayer dielectric layer comprise, between their opposing portions, both the dielectric material and the negative capacitance material, and/or at least one second conductive interconnected part formed in the upper layer of the interlayer dielectric layer, and at least one third conductive interconnected part formed in the lower layer of the interlayer dielectric layer comprise, between their opposing portions, both the dielectric material and the negative capacitance material.