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1. (WO2017156829) SUBSTRATE PACKAGING METHOD

Pub. No.:    WO/2017/156829    International Application No.:    PCT/CN2016/080188
Publication Date: Fri Sep 22 01:59:59 CEST 2017 International Filing Date: Wed Apr 27 01:59:59 CEST 2016
IPC: H01L 51/56
H01L 51/52
Applicants: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
深圳市华星光电技术有限公司
Inventors: LIU, Yawei
刘亚伟
Title: SUBSTRATE PACKAGING METHOD
Abstract:
A substrate packaging method. By forming multiple support parts (12) disposed at intervals along the edge of a package cover plate (10), a gap between the package cover plate and a substrate (20) to be packaged is defined after the package cover plate is aligned and attached to the substrate (20), so that the height of a spacer-free sealant (15) can be guaranteed, and the width of the sealant can also be guaranteed in the case that the coat weight is constant; after the package process is completed, the support parts, the part of the substrate contacting the support parts, and the edge of the package cover plate are cut, so as to obtain a substrate packaged by a spacer-free sealant, so that the consistency of the height and width of the sealant is ensured, the process is simple, and the package effect is good.