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1. (WO2017156678) METHOD FOR MANUFACTURING STACKED HOLES OF CIRCUIT BOARD

Pub. No.:    WO/2017/156678    International Application No.:    PCT/CN2016/076286
Publication Date: Fri Sep 22 01:59:59 CEST 2017 International Filing Date: Tue Mar 15 00:59:59 CET 2016
IPC: H05K 3/42
H05K 3/46
Applicants: SHENZHEN SUNTAK MULTILAYER PCB CO., LTD.
深圳崇达多层线路板有限公司
Inventors: WANG, Zuo
王佐
LIU, Kegan
刘克敢
WANG, Shuyi
王淑怡
Title: METHOD FOR MANUFACTURING STACKED HOLES OF CIRCUIT BOARD
Abstract:
Disclosed is a method for manufacturing stacked holes of a circuit board, the method comprising the following steps of: a pre-procedure, manufacturing a circuit board, the circuit board comprising a core board layer (30) and an inner-layer plate (20) and an outer-layer plate (10) pressed outside the core board layer (30) successively; mechanical drilling, using a mechanical drill to mechanically drill the circuit board, drilling through the outer-layer plate (10) and part of the inner-layer plate (20), and retaining some medium (40) of the inner-layer plate (20) to form a blind hole (50); laser drilling, using a laser drill to drill through the remaining part of the medium (40) of the inner-layer plate (20) up to a surface of the core board layer (30) so as to form stacked holes (60); and a post-procedure, performing processing of the remaining procedure on the circuit board in which the stacked holes (60) have been processed. The method for manufacturing stacked holes of the circuit board can reduce a rejection rate of products, and improves the quality for manufacturing the stacked holes (60) of the circuit board.