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1. (WO2017156671) CHIP PACKAGING APPARATUS AND METHOD THEREOF

Pub. No.:    WO/2017/156671    International Application No.:    PCT/CN2016/076233
Publication Date: Fri Sep 22 01:59:59 CEST 2017 International Filing Date: Tue Mar 15 00:59:59 CET 2016
IPC: H01L 21/60
Applicants: CAPCON LIMITED
华封科技有限公司
Inventors: YU, Feng
俞峰
WANG, Hong Gang
王宏刚
LI, Yang
李洋
WANG, Yong Xin
王永新
Title: CHIP PACKAGING APPARATUS AND METHOD THEREOF
Abstract:
Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.